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μ PC8204TK
8.
9.
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation).
All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
(3) The bypass capacitor should be attached to the V CC terminal.
(4) Impedance matching circuit must be each externally attached to input and output ports.
(5) The DC capacitor must be attached to input terminal.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
methods and conditions other than those recommended below, contact your nearby sales office.
For soldering
Soldering Method
Soldering Conditions
Condition Symbol
Infrared Reflow
Wave Soldering
Peak temperature (package surface temperature)
Time at peak temperature
Time at temperature of 220 ° C or higher
Preheating time at 120 to 180 ° C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (molten solder temperature)
Time at peak temperature
: 260 ° C or below
: 10 seconds or less
: 60 seconds or less
: 120 ± 30 seconds
: 3 times
: 0.2%(Wt.) or below
: 260 ° C or below
: 10 seconds or less
IR260
WS260
Preheating temperature (package surface temperature) : 120 ° C or below
Maximum number of flow processes
Maximum chlorine content of rosin flux (% mass)
: 1 time
: 0.2%(Wt.) or below
Partial Heating
Peak temperature (terminal temperature)
Soldering time (per side of device)
Maximum chlorine content of rosin flux (% mass)
: 350 ° C or below
: 3 seconds or less
: 0.2%(Wt.) or below
HS350
Caution Do not use different soldering methods together (except for partial heating).
32
Data Sheet PU10408EJ02V0DS
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